Diamond is the most complex material to machine. Not only is it the hardest substance on earth, but it also has the most unpredictable internal structure. A structure that contains many different plane that can only be cut in specific directions. When cutting a single facet, finding the cutting direction will be fairly simple, however when trying to grind a 3 dimensional radius in the crystal, with sub-micron form accuracy it becomes a whole other issue.
Dependant of the radius sweep, you will most likely encounter multiple planes of the diamond, dependant of the angle of attack presented, these various planes will present various resistance to grinding. The key to efficient Controlled Waviness tool manufacturing, is to predict and anticipate locations of such opposing planes and take compensating measures to ensure minimal resistance variations within the total sweep of the radius.
Such procedure should be implemented as part of the pre-grind process to ensure that when the tool gets to the grinding stage, it will offer maximum chances of success on the first attempt at generating a controlled waviness radius on the diamond.
DiamTech has over a decade experience with observing and analysing diamond behaviour during grinding has developed a comprehensive orientation method that produces consistent, high yield ratio results on the first attempt. With delivery delay being a crucial aspect of the competitiveness in this industry, first attempt yield becomes a important aspect.
Anyone venturing into manufacturing ultra precision controlled waviness diamond tools, will quickly be faced with the many variables that will play a role and define their production capability and efficiency, DiamTech can help propel you decades ahead with our in-dept, hand-on experience with dealing with all these variable.
After all in our industry, nanometers often represent mile stones...
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